SS board Capacity
| Minimum conductor width | 0.15mm |
|
Minimum conductor space |
0.15mm |
| Minimum punching hole's diameter (FR-4) | 〼2mm |
|
Minimum punching hole's diameter (CEM-3) |
〼0.8mm |
|
Minimum punching hole's diameter (CEM-1) |
〼0.7mm |
| Paper base minimum punching hole's diameter (XPC/FR-1/FR-2/ETC) | (1.5x2.0)mm |
| Minimum punching abnormal shape groove (FR-4) |
(0.8x1.2)mm |
|
Minimum punching abnormal shape groove (CEM-3/CEM-1) |
0.3mm |
|
Minimum punching abnormal shape groove (Paper base boaed) |
(0.8x1.0)mm |
| CNC minimum diameter of hole | 0.38mm |
|
CNC minimum abnormal shape groove. |
(0.8x1.0)mm |
|
USA ULSecurity Certificate minimum thickness |
0.38mm |
| Finished voard's maximum size. | 650mmx490mm |
| E-test maximum holes. | 4096 |
| SMT E-test minimum space of foot | 0.5mm |
| Carbon ink jumper resistance |
<30Ω / □ (PER SQ.AREA) |
| Surface treatment | HASL(lead and lead-free) oxidation-resistant |
DS board Capacity
| Base material | FR-4;Fr-5;CEM-1;CEM-3;Aluminium base PCB,halogen-free FR-4 |
| Maximum size of DS-board | 610mmx440mm |
| Minimum diameter size of plating hole | 〼0.2mm |
| Minimum conductor width | 0.1mm |
| Minimum conductor space | 0.1mm |
| Solder mask's color | Green / Blue / Black / Yellow |
| The colour of word printing | White / Black / Blue |
| Character minimum width | 0.125mm |
| Wall of hole's plating average thickness | 25μm |
| Plate of wall if hole minimum thickness | 20μm |
| Surface treatment | HASL (lead and lead-free), plating/ENIG, OSP |
| HASL minimum thickness | 2.5μm |
|
HASL maximum thickness |
30μm |
| (NI-AU) nical layer maximum thickness | 3μm |
|
(NI-AU) nical layer minimum thickness |
7μm |
| Bare board test maximum size | 610mmx508mm |
| On-off voltage | 300V |
| Micro-resistance test | ±1mΩ |
| Special machine word | ±0.10mm |
| DS-board Machine Work | ≤0.75% |
| Laser drawing maximum area | 660mmx508mm |
| Precision of laser |
8000 line |
| Laser repetition precision | 0.0127mm |
| Characteristic impedance | ≥50Ω ±8%; <50Ω ±4Ω |
Multi-layer boards Capacity
|
Feature / Year |
Y2015 |
Y2016 | Y2017 | |
|
Max Layer Count(L) |
10 | 12 | 16 | |
|
Production Panel Size mm(inch) |
483*622.3(19*24.5) | 483*622.3(19*24.5) |
483*622.3(19*24.5) |
|
|
Min/MAx core thickness(mm) |
0.05 |
0.05 |
0.05 |
|
|
Min Dielectric thickness(mm) |
0.05 |
0.05 |
0.05 |
|
|
Board thickness |
Min / MAx(mm) | 0.3/3.2 | 0.18/4.2 | 0.18/4.2 |
|
Copper thickness μm(OZ) |
105μm(3OZ) |
105μm(3OZ) |
140μm(4OZ) |
|
|
Line width / Space,MIN |
Innerlayer μm(1OZ) |
89μm/89μm(3.5/3.5mil) |
75μm/75μm(3/3mil) |
75μm/75μm(3/3mil) |
|
Outerlayer μm(HOZ) |
100μm/100μm(4/4mil) | 89μm/89μm(3.5/3.5mil) | 75μm/75μm(3/3mil) | |
|
Through Via diameter |
Max finished hole | 6.5 | 6.5 | 6.5 |
|
Min finished hole |
0.15 | 0.15 | 0.15 | |
|
AR |
8:1 | 9:1 | 10:1 | |
| Min BGA (mm) | 0.4 | 0.4 | 0.4 | |
|
Min SMT (mm) |
0.4 | 0.4 |
0.4 |
|
|
Inner Layer Clearance |
8L | 0.19mm(7.5mil) | 0.18mm(7mil) |
0.18mm(7mil) |
| 10-12L | 0.2mm(8mil) | 0.19mm(7.5mil) |
0.19mm(7.5mil) |
|
|
Solder mask Registration (mm) |
±0.05mm |
±0.05mm |
±0.038mm | |
| Impedance control tolerance | ±10% |
±8% |
±8% |
|
|
Warpage |
0.75% | 0.6% |
0.6% |
|
| Surface treatment | 0.025μm-0.10μm(1-4μinch) |
0.025μm-0.10μm(1-4μinch) |
0.025μm-0.10μm(1-4μinch) |
|
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