Standard PCB (1-4 layers) Advanced/Premium PCB (6-30 layers, HDI)
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Raw Material
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• FR-1; FR-2; FR-3; FR-4;CEM-1; CEM-3; FR-4(Tg130~150);
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✔ High performance FR4;
✔ Halogen-free FR4;
✔ Large size & stable performance material;
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Printing Ink
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• Regular ink
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✔ High performance ink;
✔ Halogen-free ink;
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Drilling
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• CNC drilling
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✔ CNC drilling;
✔ Laser micro drilling;
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PTH
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• Copper plating;
• Conductive polymer coating;
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✔ Copper plating;
✔ Nanometer graphene coating;
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Hole plating
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• Gantry style electroplate
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✔ Gantry style electroplate;
✔ VCP continuous vertical plating;
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Artwork
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• Circuit printing
• Dry film adhesive,Scattering light exposure
• Parallel light exposure
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✔ Parallel light exposure process;
✔ LDI laser exposure process
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Etching
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• Chemical etching
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✔ Chemical etching;
✔ Laser etching;
✔ Vacuum etching;
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Layer Stack-up
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• Electric heat press machine;
• Hot oil press machine (small-scale);
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✔ Hot oil press machine (large-scale);
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Soldermask
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• Direct printing
• Exposure developing
• Silkscreen printing
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✔ Exposure developing
✔ Silkscreen printing
✔ Electrostatic spraying
✔ Vacuum printing
✔ Resin/ink plug hole
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Silkscreen
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• Silkscreen printing
• Inkjet printing
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✔ Screen printing
✔ Hd inkjet printing
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PCB Profile
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• Die punching
• CNC routing
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✔ High precision CNC routing process
